Heatsink: thermal paste instead of the thermal tape?

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Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Tue Jan 28, 2014 7:28 pm

I'd like to use a thermal paste with the heatsink instead of the thermal tape, removing the latter.

As far as the heatsink covers (and cools?) several chips it's needed, for my purpose, that their upper surfaces are more or less in one plane.
Does anybody knows if these upper surfaces are leveled good enough for applying a thermal paste instead of the relatively thick thermal tape?

Thank you.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Tue Jan 28, 2014 8:30 pm

I agree the thermal paste will be slightly better than thermal tape.

My concern is that our heatsink can damage your board. :o
The thermal paste can't make complete isolation of the electonic components from metal surface of heatsink.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Tue Jan 28, 2014 8:50 pm

Thank you odroid.

Searching with Google for an sideview image of U3 I accidentally found a post very close to my thread:
http://www.jarlath.net/2014/01/odroid-u ... e-starcie/

It is in Polish but chromium-browser offers me translation of the page.

I'm scratching my head :?
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sat Feb 01, 2014 2:45 am

Now my tomorow's experiment:
I'll use a simple script writing to file the CPU temperature in 1 second interval.

My new U3 is not touched or hacked as for now.

0. <poweron>
1. As U3 came to me (default, till now it is rock solid) I'll run some tests* about temperature.
2. Detach the heatsink in situ, e.g. while U3 is running. At minimal load of coarse. Watching the temperature of CPU - naked without heatsink.
3. Peeling off the thermal tape and putting the heatsink back freely on the CPU. In situ again.
4. <poweroff>
5. Attaching the heatsink to the board by the latches. No thermal tape, no thermal paste.
6. <power on>
7. Putting in situ a 1.55 mm spacer beneath the one end of the heatsink surface as described by the Polish guy that I cited.
8. <poweroff>
9. Lifting off the heatsink and applying a tinny drop of beryllium oxide thermal paste on the CPU surface. Mounting down the heatsink carefully and slowly.
10. <power on>

All temperatures between <power on> and <poweroff> should be written to SD-card by the script. And I'll draw graphs "time<->CPU temperature" for a report here.

That is for now :) :o


-----------------------------------
* - I need two tests for CPU load in high and in middle loads. Need your advise please.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby mdrjr » Sat Feb 01, 2014 4:30 am

For high loads. apt-get install cpuburn
burnCortexA9 is the app.

I don't know for medium loads ;(
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sat Feb 01, 2014 11:09 pm

I'm starting.
The script is simple:
Code: Select all
#!/bin/bash

for (( ; ; ))
do
cat /sys/class/thermal/thermal_zone0/temp>>heatsink
sleep 1
done

Edit: I modified it and used "|tee -a heatsink" instead of ">>heatsink" for to see output in the console too.

Now giving the U3 hard time by "burnCortexA9" loaded times one after one.
Last edited by Vort on Tue Feb 04, 2014 3:46 am, edited 4 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sat Feb 01, 2014 11:38 pm

Point 1.

Raw temperature data (1 second interval) of running 3 instances of burnCortexA9 on U3. Ambient temperature is 13oC.
(At the end the thermal switch off came in place):
http://pastebin.com/uBy8Bkgi

As it can be seen the initial temperature starts at 40 degrees and jumps while subsequently loading three CPUs by 100%. At the end the thermal shutdown takes place.
Attachments
As_is.png
Last edited by Vort on Mon Feb 03, 2014 7:44 pm, edited 3 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sun Feb 02, 2014 12:13 am

Point 2.
While running detached the heatsink and left the CPU/GPU chip naked (free).
Ran two instances of burnCortexA9 and after reaching 101oC turned them off one by one.
Raw data http://pastebin.com/viZxyjwi

After detaching temperature raises from 35 to 37 degrees.
One can see that the temp. of both unloaded and 1x100% loaded naked CPU/GPU is substantially lower as compared with the original U3 setup. I was surprised but after all those chips are construkted to work in mobile devices w/o heatsink, isn't it?
However it reaches 100 degrees at 2x100% as compared to 3x in the original setup.
Attachments
Original_vs_naked.png
Last edited by Vort on Mon Feb 03, 2014 8:04 pm, edited 2 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sun Feb 02, 2014 12:22 am

Skipping the second part of point 3 and skipping point 4.

The heatsink surface is not polished well but the thermal tape peeled off well leaving the heatsink surface clean (pulling it off slo-o-ow-ly ;) )

Now performing point 5.
Last edited by Vort on Sun Feb 02, 2014 1:48 am, edited 2 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sun Feb 02, 2014 12:56 am

Point 5 is attaching back by the latches the heatsink naked e.g without the thermal band.
In situ e.g while U3 is running.

Done.
Ran 3 instances of burnCortexA9 and finally temperature shutdown took its place.
But it was a longer time than with the default heatsink with attached thermal tape.
Raw data:
http://pastebin.com/bgnUrUeZ

The black line represents the case of mounting back the heatsink after removing its thermal tape.
As it was done in situ you can see temperature starts at 38 degrees (naked chip) and drops to 30 after mounting the heatsink.
Inserted is a smaller graph representing comparison between the original setup (heatsink with thermal tape, blue line) and the heatsink without thermal tape, laying directly on the chip - green line.
The cooling is better as compared both to naked chip and original setup.
Attachments
Naked_vs_hs-without-tape.png
Last edited by Vort on Mon Feb 03, 2014 8:57 pm, edited 2 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Sun Feb 02, 2014 11:12 am

Oh... very interesting and intensive test. :o
I wanna see the graph!
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Mon Feb 03, 2014 9:07 pm

After the steps described above I put a 1.55 mm spacer between the board and bottom surfase of the heatsink - for leveling as described in the previous citation
http://www.jarlath.net/2014/01/odroid-u ... e-starcie/
after that I removed the spacer and compared the results.
I found the temperatures being slightly lower without than with spacer so didn't use it.

As you can see in the big graph temperatures with heatsinc leveled by a spacer are slightly higher. So I applied thermal paste and mounted the sink w/o spacer.

But I'm somewhat confused...
The sequence was
a) mounting the sink after I removed the tape - unleveled;
b) leveling the sink in situ with the spacer;
c) removing the spacer - unleveled.
Now In the little inserted graph you see the temp. of both unleveled cases and evidently I had much better cooling in a) than in c) - though logically they should be equal.
Attachments
With_without_spacer.png
Last edited by Vort on Mon Feb 03, 2014 10:50 pm, edited 2 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Mon Feb 03, 2014 10:05 pm

Applied a beryllium oxide thermal paste on the chip and mounted the other heatsink that's with a fan on it.

Let me say again that all measurements were carried out at 13 degrees Celsius ambient temperature.

The news here is that with fan cooling I could run all 4 x 100% load
Blue line is heatsink with fan not attached to board. Made twice second cycle ends with thermal shutdown.
Green line is heatsink with fan working.
For reference original setup is shown as black line.
Attachments
Thermal_paste+fan.png
Last edited by Vort on Mon Feb 03, 2014 11:42 pm, edited 2 times in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Mon Feb 03, 2014 11:39 pm

Great analysis of thermal characteristics!
I've changed this "Sticky".
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Tue Feb 04, 2014 3:13 am

Thanks odroid!

I'm gonna do some more tinkering.
I'd like to try the next:
-- removing the thermal paste of the recent setup here;
-- repeating again all the previous measurements except Point 1 that is not repeatable;
-- trying to find the best planar fit of the chip surface to the bottom heatsink surface.
Will be done at next weekend and reported as summary with the graphs posted but with an emphasize on comments .

Please don't consider these my reports/findings as a truth for everybody. No, please.
There are some more things that I have to report else.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby leal » Thu Feb 06, 2014 11:14 am

Great analysis Vort.

I tried a variation of your naked heatsink configuration. I removed only a quadrant of the thermal tape that makes contact with the CPU, but keeping the electrical insulation properties recommended by odroid on the parts of the heatsink that do not make contact with the CPU. This gave me improved thermals compared to the stock setup. With the stock setup, the chip would hit 85C pretty easily, e.g. testing Youtube HTML5 playback at 480p for 30 seconds. Now with the same Youtube playback test, the chip is reading 65C. After playback for a few minutes, the chip reads 71C.

I'm sure even the cheapest thermal paste would be even better, but I don't have any off hand to try.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Thu Feb 06, 2014 6:36 pm

I'm glad it works!
Your solution is better I think. :)

For your information after I was done with the "naked heatsink" measurements I made a careful visual inspection looking through against a distant lamp in the dark.
I found that the h/s contacts only one element - the one that I marked with a blue circle on the image (taken from jarlath.net, many thanks!).
See in attachment.

There were no damages to the board as far as I understand but I put a piece of very thin plastic between the bottom of the heatsink for assurance.
Attachments
ODROID-U3-Heatsink-spacers_M.png
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Thu Feb 06, 2014 6:55 pm

The small capacitor in the blue circle of above picture is not a working component.
It is a stand for the heat sink and there is no silk printing of reference number
Don't worry about the electrical short on that capacitor. ;)
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Thu Feb 06, 2014 7:11 pm

A useful info, thank you!
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Thu Feb 06, 2014 7:17 pm

odroid wrote:It is a stand for the heat sink

So probably this capacitor and the SoC chip are of the same height?
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Thu Feb 06, 2014 7:21 pm

It was our goal..
But the height of capacitors are not even.
Some batch is okay.. but sometimes it was thinner. :(
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sat Feb 15, 2014 2:20 am

Now I've got "Zalman ZM-NBF47" heatsink and I'll try it.

Anybody any concerns on replacing stock U3 heatsink by Zalman ZM-NBF47 heatsink?
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Sun Feb 16, 2014 12:30 am

Success.

I was able to mount "Zalman ZM-NBF47" passive heatsink on U3.
Frankly it was hard to me.
And I had to level it by additional piece of wood :lol:
See some pics of poor quality in the attachment.

One of the edges is near the HDMI port so beware if you try the same.

I'll post the graphs in Monday.
Now preliminary I'd say it was possible to run all four cores at 100% load and the temperature was 103 deg.cent. at max and around 97-98 as a mean value.
Attachments
Zpics.zip
(928.11 KiB) Downloaded 319 times
Zalman_pics.zip
(964.5 KiB) Downloaded 300 times
Side1.zip
(499.11 KiB) Downloaded 241 times
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Thu Feb 20, 2014 4:02 pm

Vort wrote:Now preliminary I'd say it was possible to run all four cores at 100% load and the temperature was 103 deg.cent. at max and around 97-98 as a mean value.

The next day after I mounted Zalman heatsink cooling was better.
Max. temperature with all four cores at 100% load was 93 deg. with mean about 88-89 deg.
May be the thermal paste relaxed and found its good places? :)
By the way I did some "ironing" of the thermal paste by heating-cooling cycles.

Today idle temperature is 30 deg. with ambient temp. 18.5 deg.
Code: Select all
odroid@odroid-server:~$ cat /sys/class/thermal/thermal_zone0/temp
30000
odroid@odroid-server:~$


I'm not ready with the graphs yet.
If there are people interested in I'll post them soon.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby keithsloan52 » Sat Feb 22, 2014 12:08 am

mdrjr wrote:For high loads. apt-get install cpuburn
burnCortexA9 is the app.

I don't know for medium loads ;(


Out of interest does cpuburn stress both the GPU and the CPU?

I would like to run boinc processes at 100% and from reading this thread I would be limited to 2 processors without a heat sink.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby mdrjr » Sat Feb 22, 2014 2:02 am

Just CPU :(
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Elric » Thu Feb 27, 2014 1:01 am

keithsloan52 wrote:I would like to run boinc processes at 100% and from reading this thread I would be limited to 2 processors without a heat sink.

I'm running boinc on my two u3 24/7 on all 4 cores at 100% with original heat sink and a 80mm case fan (12V). One is running android with nativeBoinc the other is running ubuntu and boinc.
Yesterday I found the commands to read cpu frequency and temperature on ubuntu shell in this forum. A short lookup revealed 1704MHz and 64°C temperature.

On the android u3 I don't have the possibility to check temperature because it runs headless. But nativeBoinc lists hosts based on clock speed that means if a device is throttling you find different host entries on nativeBoinc host statistics. The android u3 is listed once with 1704MHz so temperature must be below thermal throttling temperature.
Using 2xU3 and 2xXU3 Lite fro Boinc
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Thu Feb 27, 2014 12:25 pm

To see the temperature in Android without HDMI, you need a micro-USB cable.
Install ADB driver and utils on your PC. And you can "adb shell" to run a system console on your PC.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby racmar » Sun Mar 16, 2014 1:25 pm

Hi community,

I replaced the Heatsink with the passive Xilence Northbridge Heatsink.
I was not sure about the Zalman, as all the Zalman Heatsinks had that reduced base plate size for the mounting stuff. So I chose this one and I am pretty happy with the fit of this heatsink - it fits almost the way like the stock one.

Here's a photo of the Heatsink mounted
Image- Click for larger image

The only concern I had was, the Serial terminal port Connector on the board blocks the Mounting strap, so it pushes the heatsink far towards the USB ports. But it fits really great, like this it comes directly onto the "heatsink Stand Capacitor" and fits perfectly.

You can see the blocked strap on this Image quite well:
Image- Click for larger image

I found another Heatsink that should fit accordingly, have similar cooling capacities but doesnt build that high:
The Coolermaster PAC-P01 :

Image- Click for larger image


I was frightened, as the device ran over 40° on idle when the stock heatsink was mounted, so I ran AnTuTu Benchmark on Android with the Heatsink mounted. It didn't exceed 60° (as after the overlay) while all 4 Cores showed peak loads of 100% simultanously. On idle the Temperature was only a few degrees over environment temp.

Unfortunately, both heatsinks are no longer produced, so it gets quite hard finding one to purchase...
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Mar 30, 2014 4:52 am

Holding steady at 80C with a 12v 8.5 cfm fan stock heatsink and thermal tape with 4 instances of burnCortexA9 going.

http://i.imgur.com/GJD8W9K.jpg

Image
Last edited by nwong on Sun Mar 30, 2014 4:58 am, edited 1 time in total.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Mar 30, 2014 4:56 am

racmar wrote:Hi community,

Unfortunately, both heatsinks are no longer produced, so it gets quite hard finding one to purchase...


Frozen CPU has lots of options for passive chipsinks:

http://www.frozencpu.com/cat/l3/g40/c16 ... Page1.html
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Mar 30, 2014 10:52 am

nwong wrote:Holding steady at 80C with a 12v 8.5 cfm fan stock heatsink and thermal tape with 4 instances of burnCortexA9 going.


Pulled off the stock heatsink, applied some Antec Formula 7 only to the CPU and now I'm running 4x burnCortexA9 at a much more reasonable 67C.

Gonna try to OC to 2.0Ghz now, if I can figure out how to OC this thing....

Nick
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Mar 30, 2014 11:26 am

Single Thread OC results.

SCI Mark 2.0 @ 1.7Ghz: Max Temp 39C
Composite Score: 156.5

SCI Mark 2.0 @ 1.8Ghz: Max Temp 40C
Composite Score: 165.3 5.6% Faster

SCI Mark 2.0 @ 2.0Ghz: Max Temp 42C
Composite Score: 183.5 17% Faster

Update: multi thread

MultiThreaded, 7za b score:
1.7Ghz> 5077 MIPS : Max Temp 53C
1.8Ghz> 5667 MIPS : 12% Faster! Max Temp 58C
2.0Ghz> 6272 MIPS : 23% Faster! Max Temp 63C


Considering it was idling at 60C before, I see no reason not to run it at 2.0Ghz with this setup.

Compared to my i5 3570K Ivy Bridge desktop computer running @4.2Ghz 18342 MIPS. So 3x ODROID = one overclocked gaming rig. :D At least at zipping things.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Apr 06, 2014 2:20 am

Minor update.

I bought a pack of copper chipsinks that use 3m thermal tape and are designed to go on high end video card memory chips:

Image

Full size: http://i.imgur.com/bmXRh2O.jpg

Unfortunately, the results aren't as good as I hoped. The idle temperatures are lower, and with a fan the same results are achieved as using the thermal paste on the aluminium heatsink. I'm going to do a more in depth comparison with the original heatsink, original heatsink with fan, original heatsink with good thermal paste, original heatsink with good thermal paste and a fan, the full copper chipsink, and copper chipsink with fan later today. As of now, I really feel like the original heatsink with good thermal paste and a fan is the best so far.

I considered trying to lap the heatsink down to a mirror and go for a no-paste mirror to mirror setup, but I don't see how I can mirror finish the chip on the board.

More results later.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby nwong » Sun Apr 06, 2014 11:42 am

Here's the results of the tests.

The test went like this:
1. Start up the board, get it hot by running burnCortexA9 for a little while.
2. Stop all instances of burnCortexA9 and wait for temps to level out.
3. Record temp for 60 seconds with nothing running.
4. Start one instance of burnCortexA9 for 60 seconds while recording temps.
5. Start one instance of burnCortexA9 for 60 seconds while recording temps.
6. Start one instance of burnCortexA9 for 60 seconds while recording temps.
7. Start one instance of burnCortexA9 for 60 seconds while recording temps.
8. Stop all instances of burnCortexA9 and allow temps to drop.

Here's the results graph:

full size> http://i.imgur.com/7RxGWTa.jpg
Image


Ultimately, the largest factor by far is using the fan. Here's the fan I used:
http://www.newegg.com/Product/Product.a ... 6835104005
40mm 8.5 CFM. This is probably a whole lot stronger than whatever comes with the Odroid fan kit, but I wanted to give the fan the best possible chance.

Anyway, for the extremely minor gains, I don't see why you would bother with any of these mods if you plan on using the Odroids at 100% CPU on all cores. You'd do better to get a progressively stronger fan.

EDIT:

All of the fan assisted temps stayed at max CPU without throttling. Here's the throttling that happened with the passive setup:

Image

Based on this, I guess you could make an argument for thermal paste, since it was throttled the least.

EDIT:

I think I'm going to try this with a giant heat sink with a huge fan just to see what happens.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby jleeca » Thu Apr 24, 2014 10:20 am

My results;

Replaced the stock heatsink with the following fan;

http://www.ebay.com/itm/40mm-Aluminum-2 ... OU:US:3160

Although the fan itself seems to be same to the odroid fan, the connector is little bit big and didn't fit so I had to cut wires and solder them to the board directly. Before attaching the fan to the board I removed the thermal tape from the original heat sink and reattached to the bottom of the new fan and then removed the square block so the thermal compound that I applied to the chip can touch the heat sink directly. I used artic MX-4 thermal compund as it is Non-conductive.

I ran "openssl speed -multi 4" command for 10 minutes to stress test cpu and found the max temperature is 93 celsius and CPU remained at 1.7GHz all the time. This is a big improvement as the CPU used to get throttled down to 0.8Ghz before the upgrade
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby HiDeHo » Thu Jun 05, 2014 7:13 pm

Vort wrote:Now I've got "Zalman ZM-NBF47" heatsink and I'll try it.

Anybody any concerns on replacing stock U3 heatsink by Zalman ZM-NBF47 heatsink?


why not get the official U2/U3 fan. its made for the odroid and works properly giving a good cooling.
I appreciate all who take the time to contribute to improve and help make things better for all.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Fri Jun 06, 2014 4:10 pm

HiDeHo wrote:
Vort wrote:Now I've got "Zalman ZM-NBF47" heatsink and I'll try it.

Anybody any concerns on replacing stock U3 heatsink by Zalman ZM-NBF47 heatsink?


why not get the official U2/U3 fan. its made for the odroid and works properly giving a good cooling.

I got the HK heatsink with fan but it turned out the fan is some noisy for me. I am running U3 7/24 at a moderate CPU load so I chose the passive cooling option. I tried both HK and Zalman heatsinks and I found the latter is better in passive cooling.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby joesy » Mon Jun 09, 2014 8:38 pm

Vort wrote:I got the HK heatsink with fan but it turned out the fan is some noisy for me. I am running U3 7/24 at a moderate CPU load so I chose the passive cooling option. I tried both HK and Zalman heatsinks and I found the latter is better in passive cooling.

Wich kernel are you using? I started with 3.8.13.18, but the fan was very noisy for me too: starting at 50C with a high (but not the highest) speed. I wrote a shell-script to 'manually' control the fan. It worked well.
With the current kernel (3.8.13.23) i don't need the script anymore. You can give the start-temperature (default 50 C, I prefer 55 C) and the kernel control the fan very smoothly. I am happy with it.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Tue Jun 10, 2014 10:37 pm

I am with
Code: Select all
uname -a
Linux odroid-server 3.8.13.16 #1 SMP PREEMPT Tue Feb 11 10:47:21 BRST 2014 armv7l armv7l armv7l GNU/Linux


Thank you for the tip, may be I should consider updating.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby BaGRoS » Sat Jun 21, 2014 4:51 am

I chose this, unfortunately, can not be installed:
http://www.frozencpu.com/products/5519/ ... 40c16s1861
what you propose, copper, similar size, for easy installation.
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby BaGRoS » Sun Jul 06, 2014 6:02 am

Please help because my device is overheating!!
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby odroid » Sun Jul 06, 2014 1:03 pm

Why don't use our active cooler?

Anyway, refer this link too.
viewtopic.php?f=65&t=1905
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Thu Mar 12, 2015 3:17 am

So far I am satisfied with my cooling (U3 dedicated to one purpose taking no more than .25 of the CPU power).

-- Now, just for the fun, I'd like to repeat the heaviest experiment regarding CPU load - after this time that passed. (I'll do it this weekend)

-- Then I'll try to elucidate if there is a difference between the heatsink posed horizontal or vertical.

-- After that I plan to try, by a hair fan, how the turbulence is influencing the cooling.

-- And after all this I'll dip the heatsink in a water-ice medium. :D

Anybody has any opinion on this plan that could help?
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Re: Heatsink: thermal paste instead of the thermal tape?

Unread postby Vort » Tue Mar 24, 2015 8:03 pm

Yesterday I repeated the test made February past year.

Reminder: I use a passive Zalman heatsink on my U3 glued to the CPU/GPU chip by a thermal paste.

The results are shown in the graph below.
Red colour represents the test made more than a year ago and black represents the test made yesterday.
The numbers 1,2,3 and 4 show how many instances of cpuburn are run at that time: "2" means 2 CPU cores loaded at 100% for example.
As tests were made at different room temperature, for correct comparison the results are shown as degrees over the room temperature (I simply subtracted 13 or 19 from the corresponding actual temperatures).

As I was expecting the now cooling is better than this of when I attached the Zalman heatsink.

Image


Additionally I made another test with dipping the heatsink fins into an ice/water mix (0 degrees centigrade) while running all 4 instances of cpuburn. The temperature dropped down to steady 65 degrees cent..
Since this is the best cooling agent, except liquid gases of course, I assume that 65 degrees is the best that this heatsink can provide for maximum loaded CPU.
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