I'm trying using indium thermal pads with an Odroid H3+.
After disassembling the heat sink, I found out that the contact between the two CPU dies and the heat sink goes through a copper plate with thermal paste between the dies and the copper plate and then between the copper plate and the heat sink. See attached images.
Indium and copper can interact so I need to avoid using the copper plate (see https://www.indium.com/blog/indium-copp ... dering.php)
QUESTION: what do you think about removing the gray soft shim spacer on the heat sink, not use the copper plate and have a direct layer of indium between the dies and the heat sink, and being careful not to break the dies by screwing the heat sink too hard?
Odroid H3+, trying indium thermal pads
- domih
- Posts: 722
- Joined: Mon Feb 11, 2019 4:48 pm
- languages_spoken: English, French
- ODROIDs: UX4, HC2, N2, N2+, H2, H2+, C4, HC4, M1, H3, H3+ - 1GbE, 2.5GbE, 10GbE, 45+ GbE
- Location: San Francisco Bay Area
- Has thanked: 257 times
- Been thanked: 214 times
- Contact:
Odroid H3+, trying indium thermal pads
- Attachments
-
- 20230903_124822.png (858.66 KiB) Viewed 328 times
-
- 20230903_124815.png (1.2 MiB) Viewed 328 times
-
- 20230903_121212.png (1.12 MiB) Viewed 328 times
- odroid
- Site Admin
- Posts: 41542
- Joined: Fri Feb 22, 2013 11:14 pm
- languages_spoken: English, Korean
- ODROIDs: ODROID
- Has thanked: 3321 times
- Been thanked: 1836 times
- Contact:
Re: Odroid H3+, trying indium thermal pads
If you remove the soft thermal film that cushions the impact and replace it with a hard plate, the chances of damage to the CPU will likely increase.
- domih
- Posts: 722
- Joined: Mon Feb 11, 2019 4:48 pm
- languages_spoken: English, French
- ODROIDs: UX4, HC2, N2, N2+, H2, H2+, C4, HC4, M1, H3, H3+ - 1GbE, 2.5GbE, 10GbE, 45+ GbE
- Location: San Francisco Bay Area
- Has thanked: 257 times
- Been thanked: 214 times
- Contact:
Re: Odroid H3+, trying indium thermal pads
Mmm... I'm chickening out. In addition, if I remove the spacer it means the heat sink might in fact no reach the dies because it will be stopped by the fixed stand-offs on the board.
I'm going to try the indium thermal pads on a XU4 instead, direct contact, no spacer, no shim.
I'll continue this discussion in the XU4 section.
By the way this testing is to confirm or infirm a statement I read on a Tom's hardware comment post: "...indium thermal pads are as good as liquid metal without the annoyances of liquid metal." Because you cannot trust what you read on the Internet, I'd like to test it

- rooted
- Posts: 10366
- Joined: Fri Dec 19, 2014 9:12 am
- languages_spoken: english
- Location: Gulf of Mexico, US
- Has thanked: 801 times
- Been thanked: 655 times
- Contact:
Re: Odroid H3+, trying indium thermal pads
I don't believe this for a second, if it were Sony would have used indium instead of gallium on the PS5.domih wrote: By the way this testing is to confirm or infirm a statement I read on a Tom's hardware comment post: "...indium thermal pads are as good as liquid metal without the annoyances of liquid metal." Because you cannot trust what you read on the Internet, I'd like to test it
Who is online
Users browsing this forum: No registered users and 1 guest